In-house testing methods like AOI, X-Ray, and functional checks ensure PCBA assemblies meet stringent quality standards before shipment. These techniques catch defects early, minimizing rework and field failures for OEMs and engineers.
AOI uses high-resolution cameras and multiple LED light sources to scan assembled boards post-SMT or reflow soldering. It detects visible defects such as missing components, misalignments, insufficient solder, bridges, or polarity errors by comparing against golden samples or CAD data.
Key benefits include:
Non-contact, high-speed inspection (up to 50 cm²/sec).
Operator-independent results with >99% accuracy for Class 2/3 boards.
Ideal for high-volume runs, catching 80-90% of soldering issues.
X-Ray, or Automated X-Ray Inspection, employs real-time fluoroscopy or 3D CT imaging to penetrate boards, revealing hidden defects invisible to optical methods. It inspects BGA/QFN solder joints, via fills, internal layer alignment, and voids in multi-layer stacks.
Key benefits include:
Detects subsurface issues like head-in-pillow or microcracks.
Essential for high-reliability apps (automotive, medical) per IPC-A-610.
2D/3D modes support complex BGAs up to 1mm pitch.
Functional checks power up the fully assembled PCBA to verify real-world performance against design specs, including voltage levels, signal integrity, timing, and firmware behavior. Jigs with bed-of-nails probes or flying probes apply inputs and measure outputs via boundary scan (JTAG) or custom scripts.
Key benefits include:
Validates end-to-end operation, uncovering intermittent faults.
Supports ICT integration for opens/shorts plus dynamic tests.
Critical final gate, ensuring 100% compliance before delivery.
| Method | Best For | Speed | Cost | Detects Hidden Defects |
|---|---|---|---|---|
| AOI | Surface/solder joints | Very Fast | Low | No |
| X-Ray (AXI) | BGA/vias/internal layers | Moderate | Medium | Yes |
| Functional | Full circuit performance | Slow | Variable | Partial (powered) |
Combine AOI post-placement/reflow, X-Ray for high-density packages, and functional tests as the final QC step to achieve <500 DPMO. Foshan Krivina PCBA integrates these in our China facility with ISO 9001 certification, delivering reliable imports to India.
Ensure Your Quality: Upload Gerbers for complimentary testing quotes and DFM feedback today.
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