Our PCBA assembly services bring your bare boards and components together with precise SMT and through‑hole processes, delivering ready‑to‑use electronic assemblies.
We handle surface‑mount, through‑hole and mixed‑technology assembly, using automated pick‑and‑place, reflow and wave soldering lines backed by AOI and functional testing.
From first prototypes to regular production batches, every assembly run follows documented processes and quality checks to keep performance consistent.
Our PCBA assembly service can be provided as consigned, partial turnkey or full turnkey—covering component sourcing, PCBA handling, assembly, testing and packing from a single point of contact.
By combining fabrication, component procurement and assembly, turnkey PCBA shortens lead times, simplifies coordination and reduces the risk of delays between multiple vendors.
High‑speed SMT lines support fine‑pitch ICs and small passives, while wave or selective soldering handles connectors and high‑reliability THT components.
Inline inspections, X‑ray (where required) and functional testing help detect defects early, improving yields and long‑term field reliability.
We support low‑volume, high‑mix prototype builds as well as repeat production orders, allowing you to ramp from engineering samples to market demand smoothly.
Share your BOM, Gerbers, assembly drawings and required quantities, and we will propose the best sourcing model, pricing and lead times for your PCBA build.
Find answers on how to prepare your data, what formats we accept and how our assembly process supports your quality and schedule goals.
You typically need Gerber files, a finalized BOM, pick‑and‑place/centroid data, assembly drawings and test requirements, plus any special handling notes.
Yes, we can procure components from approved suppliers, manage alternates where needed and coordinate deliveries with PCBA fabrication and assembly schedules.
Our lines support common SMT packages (down to small passives and fine‑pitch BGAs) as well as a wide range of through‑hole connectors, power parts and mechanical components.
We use AOI, X‑ray for BGAs (when required), in‑circuit or functional testing and ESD‑safe handling and packing to ensure assemblies are production‑ready and robust.
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